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Metalink Wins InfoVision Award At Broadband World Forum Asia 200619 May 2006
Metalink Ltd. (NASDAQ: MTLK), a provider of high-performance wireless and wireline broadband communication silicon solutions, today announced that it won the International Engineering Consortium's (IEC) InfoVision Award in the category of "Enabling Silicon and Component-Level Technologies" for its 802.11n compliant WLANPlus(TM) chipset family, that supports the challenging optional specifications critical for wire-line quality consumer electronics grade, wireless multimedia distribution.
Presented at Broadband World Forum Asia 2006 in Hong Kong, the InfoVision Awards recognize technologies, applications, products, advances, and services judged to be the most unique and beneficial to the telecommunications industry. InfoVision Awards also honor corporations and individuals for their innovative contributions and developments that have proven important to society.
With a detailed and anonymous judging system in place, IEC Content Director Tom [KP1] Costello, noted, "The competition was stiff with many fine entrants. The selection process was very difficult with an exceptional group of InfoVision Awards this year. We recognize InfoVision Finalists as products that provide superior service to the industry and the community."
"We are extremely honored that our WLANPlus chipset has been awarded this recognition by the judging panel," said David Pereg, Vice President of Corporate Development at Metalink. "We are also excited by the broad acceptance of the 802.11n standard - making it a ubiquitous technology adopted by huge industries including the consumer electronics, networking, computing and the cellular industries. Our WLANPlus 802.11n chip-set family is optimized to address the consumer electronics market needs. As such it supports the most demanding optional specifications of the 802.11n standard that are critical to enable the high quality required for High-Definition video streaming throughout the home. Winning the InfoVision prestigious award acknowledges our technology as a key enabler of high-definition video streaming throughout the home in a broad range of products such as Residential Gateways, DTV, HDTV, Set-Top Boxes, Media Adaptors and Digital Video Recorders (DVR)."
Metalink is demonstrating its WLANPlus solution at The Broadband World Forum in Hong Kong, May 16-17 at booth #514.
About The Broadband World Forum Asia 2006
The IEC's Broadband World Forum Asia premiered in 2004 in Seoul, Korea with KT as the official host sponsor drawing more than 1500 industry professionals to register. The show continued with last year's Broadband World Forum Asia 2005 held in Yokohama, Japan with NTT as the official host sponsor. Increasing registration numbers by more than 50 percent, the show drew more than 3,000 industry professionals to register, included more than 150 presentations and presented more than 120 industry experts as speakers. This year, the Broadband World Forum Asia 2006 team will host more than 35 industry-leading companies to exhibit and expects approximately 3500 people to attend. For complete information, visit http://www.iec.org/events/2006/bbwf_asia/.
The IPTV Global ComForum also premieres at this year's Broadband World Forum Asia 2006 as a co-located event, which will address issues such as content licensing, market realities, managing broadband services over IP/MPLS core, security environments, digital rights management, personalization and interactivity for the end user, and more. For complete information, visit http://www.iec.org/events/2006/iptv/.
About the IEC
A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students.
In conjunction with industry-leading companies, the IEC has developed an extensive, free on-line educational program. The IEC conducts industry-university programs that have substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.
More than 70 leading high-technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. The IEC also manages the activities of the Enterprise Communications Consortium. Please visit http://www.iec.org.
About WLANPlus(TM)
The WLANPlus family consists of the company's MtW8170 baseband device and the MtW8150 radio frequency integrated circuit (RFIC). A combination of features enables Metalink's WLANPlus family to deliver multiple HDTV streams to any location within a radius of 100 feet, while maintaining full QoS performance. Innovative packet-aggregation techniques boost media access control (MAC) efficiency with double the effective throughput of other solutions. The inclusion of 2x3 real Multiple-In Multiple-Out (real MIMO) technology further improves throughput and QoS, and the use of sophisticated channel-bonding and antenna-loading techniques in the 5 GHz frequency band provide critical additional video-distribution performance.
The WLANPlus chipset also includes a full implementation of an integrated lower and upper MAC, reducing dramatically the required processing power and memory allocation from the host application processor. This simplifies the integration with consumer electronics devices and reduces the total product cost. Additionally, Advanced Low Density Parity Check (LDPC) forward error-correction (FEC) coding significantly boosts coverage range and signal robustness as compared to previous approaches. The chipset also fully supports 802.11i security features and the 802.11e QoS standard, both of which are critical for high-priority voice and video services.
About Metalink
Metalink Broadband (NASDAQ: MTLK) is a leading provider of high performance wireless and wireline broadband communication silicon solutions. Metalink's WLAN and DSL technologies are designed to enable true broadband connectivity in every home, and its products revolutionize the broadband experience by facilitating the convergence of telecommunication, networking and entertainment.
Metalink aims to redefine the home broadband experience by introducing WLANPlus(TM) - a high-throughput wireless LAN technology, 5-10 times faster than currently available wireless LAN 802.11a/b/g technologies. Featuring MIMO technology adopted by the 802.11n standardization, WLANPlus enables room-to-room networking of multiple high-definition video streams.
Metalink's DSL products offer service providers a cost-effective network upgrade to support triple-play services. Using Metalink's innovative VDSL technologies operators can deliver fiber-like speeds over existing copper infrastructure. Metalink's chipsets are deployed in millions of DSL lines by leading service providers worldwide.
Metalink is a fabless semiconductor company headquartered in Yakum, Israel. The company has subsidiaries in Atlanta (US), South Korea, and Japan as well as offices in China. Further information is available at http://www.metalinkbb.com
This press release contains "forward looking" information within the meaning of the United States securities laws that involve risks and uncertainties that could cause actual results to differ materially from those in the forward looking statements. Additional factors that could cause actual results to differ materially from these forward-looking statements are set forth from time to time in Metalink's filings with the Securities and Exchange Commission, including Metalink's Annual Report in Form F-20. Readers are cautioned not to place undue reliance on forward-looking statements. The Company undertakes no obligation to republish or revise forward-looking statements to reflect events or circumstances after the date hereof or to reflect the occurrences of unanticipated events. The Company cannot guarantee future results, events, and levels of activity, performance, or achievements.
Contact:
Mor Abraham
Marketing Communications Manager
Metalink Ltd.
Tel: +972-9-9605406
Fax: +972-9-9605544
amor@metalinkbb.com
Source: prnewswire
All trademarks and copyrighted information contained herein are the property of their respective owners.
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